Description

You will lead complex PCB design and packaging projects using Cadence tools and IPC standards.

Responsibilities

• Package circuit boards into mechanical enclosures and assemblies leveraging Cadence Design tools.
• Guide engineers on component selection, placement, stack-up, routing, and material costs.
• Manage design outputs including in-circuit test point location, artwork generation, assembly drawings, and manufacturing documentation.
• Supervise eCAD designers or external vendors and review supplier layout designs for quality.
• Own business objectives related to delivery, productivity, cost management, and quality.

Required Skills

• 7+ years of experience with complex analog, power, high speed digital, or RF PWB designs.
• Expertise in Cadence CAD capture and design tools.
• Deep knowledge of IPC PWB design principles.
• Experience with circuit stack-ups and routing for 2 to 14+ layers.
• Hands-on experience with micro-vias, very fine pitch devices, and high-density processors or FPGAs (>1000 contact BGAs).
• Proven ability to manage signal integrity constraints.
• Experience leading and supervising eCAD designers or external vendors.
• Ability to work with global suppliers and coordinate with international teams.
• Any Graduate degree.

Key Skills

Education

Any Graduate