Description

Lead complex PCB design and packaging projects using Cadence tools and IPC standards. You will package circuit boards into mechanical enclosures and assemblies, guiding engineers on component selection, placement, stack-up, routing, and material costs. Manage design outputs including in-circuit test point location, artwork generation, assembly drawings, and manufacturing documentation. Supervise eCAD designers or external vendors and review supplier layout designs for quality. Own business objectives related to delivery, productivity, cost management, and quality.

Responsibilities

• Lead complex analog, power, high speed digital, or RF PWB designs using Cadence tools.
• Guide engineers on component selection, placement, stack-up, routing, and material costs.
• Manage design outputs including test point location, artwork, and manufacturing documentation.
• Supervise eCAD designers or external vendors and review supplier layout designs.
• Own business objectives for delivery, productivity, cost, and quality.

Required Skills

• 7+ years of experience with complex analog, power, high speed digital, or RF PWB designs.
• Expertise in Cadence CAD capture and design tools.
• Deep knowledge of IPC PWB design principles.
• Experience with circuit stack-ups and routing for 2 to 14+ layers.
• Hands-on experience with micro-vias, very fine pitch devices, and high-density processors or FPGAs (>1000 contact BGAs).
• Proven ability to manage signal integrity constraints.
• Experience leading and supervising eCAD designers or external vendors.
• Ability to work with global suppliers and coordinate with international teams.

Preferred Skills

• Any Graduate degree.

Key Skills

Education

Any Graduate