You will lead chip-level implementation and physical design tasks from netlist to GDSII.
Responsibilities
- Execute chip-level floor planning, partitioning, timing budget generation, and power planning.
- Own top-level PnR, CTS, block integration, and ECO generation.
- Manage timing closure (STA) for high-frequency blocks and handle complex designs exceeding 1M instances at 1GHz+.
- Implement low power strategies including power gating, multiple voltage rails, and UPF.
- Drive signoff closure for timing (with SI and OCV), power, IR, and physical verification at both block and chip levels.
Required Skills
- 8+ years of hands-on experience in block/chip level implementation from netlist to GDSII.
- Proven tape-out experience in advanced technology nodes (3nm, 5nm, 7nm, 10nm, or 16nm).
- Proficiency with Synopsys Fusion Compiler, ICC/ICC2, or Cadence EDA Tool Suite.
- Expertise in STA, PrimeTime-SI, and PnR methodologies.
- Experience with SI prevention, fixing methodology, and layout edit techniques.
- Ability to handle blocks with 1M+ instances and frequencies above 1GHz.
- Strong debug and analytical skills for resolving design and timing issues.
- Experience working within UNIX environments.
Preferred Skills
- Scripting proficiency in Tcl/Tk, Perl, or Python.
- Experience with Synthesis and Formal verification.