Description

You will lead chip-level implementation and physical design tasks from netlist to GDSII.

Responsibilities

  • Execute chip-level floor planning, partitioning, timing budget generation, and power planning.
  • Own top-level PnR, CTS, block integration, and ECO generation.
  • Manage timing closure (STA) for high-frequency blocks and handle complex designs exceeding 1M instances at 1GHz+.
  • Implement low power strategies including power gating, multiple voltage rails, and UPF.
  • Drive signoff closure for timing (with SI and OCV), power, IR, and physical verification at both block and chip levels.

Required Skills

  • 8+ years of hands-on experience in block/chip level implementation from netlist to GDSII.
  • Proven tape-out experience in advanced technology nodes (3nm, 5nm, 7nm, 10nm, or 16nm).
  • Proficiency with Synopsys Fusion Compiler, ICC/ICC2, or Cadence EDA Tool Suite.
  • Expertise in STA, PrimeTime-SI, and PnR methodologies.
  • Experience with SI prevention, fixing methodology, and layout edit techniques.
  • Ability to handle blocks with 1M+ instances and frequencies above 1GHz.
  • Strong debug and analytical skills for resolving design and timing issues.
  • Experience working within UNIX environments.

Preferred Skills

  • Scripting proficiency in Tcl/Tk, Perl, or Python.
  • Experience with Synthesis and Formal verification.

Education

Any Graduate