Description

You will design multilayer high-density interconnect printed circuits using complex via structures.

Responsibilities

• Execute schematic capture and PCB layout using Mentor Graphics, Altium, and other industry tools.
• Manage component library design and ensure compliance with IPC PCB design standards.
• Implement EMC design considerations, high-density design, and RF signal routing.
• Design for mechanical, customer-specific, DFM, and DFT constraints.
• Coordinate with PCB fabrication and assembly vendors for Gerber release and assembly.

Required Skills

• 5+ years of experience in PCB design and layout.
• Proficiency in Altium and Mentor Graphics.
• Experience with multi-layer designs up to 12 layers.
• Expertise in multi-lam, blind and buried via, and sub .5mm pitch applications.
• Knowledge of analog and mixed-signal routing.
• Familiarity with IPC-A-600 for design and ASME/ANSI for documentation.
• Ability to manage high-density interconnect (HDI) printed circuits.
• Experience with Gerber release for fabrication and assembly.

Key Skills

Education

Any Graduate