Description

Design multilayer high-density interconnect printed circuits using complex via structures. Manage component libraries and ensure compliance with IPC standards. Coordinate with fabrication and assembly vendors for Gerber release.

Responsibilities

• Execute schematic capture and PCB layout using Mentor Graphics and Altium.
• Implement EMC design considerations, RF signal routing, and high-density design rules.
• Design for mechanical, customer-specific, DFM, and DFT constraints.
• Manage component library design and ensure compliance with IPC PCB design standards.
• Coordinate with PCB fabrication and assembly vendors for Gerber release and assembly.

Required Skills

• 5+ years of experience in PCB design and layout.
• Proficiency in Altium and Mentor Graphics.
• Experience with multi-layer designs up to 12 layers.
• Expertise in multi-lam, blind and buried via, and sub .5mm pitch applications.
• Knowledge of analog and mixed-signal routing.
• Familiarity with IPC-A-600 for design and ASME/ANSI for documentation.
• Ability to manage high-density interconnect (HDI) printed circuits.
• Experience with Gerber release for fabrication and assembly.

Key Skills

Education

Any Graduate