← Back to jobs
North Carolina
No related jobs found
You will own the design and product release for next-generation far-UVC light engines.
Master’s Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or equivalent. 6+ years of photonic or optoelectronic industry experience in new product development and product launch. Hands-on expertise in semiconductor laser diode packaging (e.g., 14-pin butterfly, TO-Cans, CoS). Experience managing photonic assembly vendors and coordinating with manufacturing teams. Skilled in statistical data analysis/visualization (e.g., JMP, R). Proficient in 3D CAD design tools (SolidWorks, AutoDesk Inventor). Strong understanding of thermal/mechanical constraints in laser packaging (heat transfer, stress, TEC). Knowledge of SPC, DfMA, FA, Root Cause Analysis, and Lean Manufacturing methods. Familiar with design constraints for on-chip photonic and electronic packaging (waveguides, wirebonds, vias, etc.). Excellent analytical, communication, and collaboration skills in multidisciplinary environments.
No related jobs found
← Back to jobs