Description

You will own the design and product release for next-generation far-UVC light engines.

Responsibilities

• Lead product design and release for packaged far-UVC light engines meeting performance targets.
• Develop optoelectronic packaging solutions addressing thermal, electrical, optical, and material challenges.
• Interface between R&D and manufacturing to ensure Design for Manufacturing/Assembly (DfMA) and Design for Quality.
• Analyze product performance data and guide requirements for prototype, pilot, and production scaling.
• Own supply-chain resolutions, troubleshooting, and failure analysis during photonic product launch.

Required Skills

• Master’s Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or equivalent.
• 6+ years of photonic or optoelectronic industry experience in new product development and product launch.
• Hands-on expertise in semiconductor laser diode packaging (e.g., 14-pin butterfly, TO-Cans, CoS).
• Experience managing photonic assembly vendors and coordinating with manufacturing teams.
• Skilled in statistical data analysis/visualization (e.g., JMP, R).
• Proficient in 3D CAD design tools (SolidWorks, AutoDesk Inventor).
• Strong understanding of thermal/mechanical constraints in laser packaging (heat transfer, stress, TEC).
• Knowledge of SPC, DfMA, FA, Root Cause Analysis, and Lean Manufacturing methods.
• Familiar with design constraints for on-chip photonic and electronic packaging (waveguides, wirebonds, vias, etc.).

Preferred Skills

• Ph.D. in Electrical Engineering, Mechanical Engineering, Physics, Optics, or Materials Science.
• Experience working with blue or UV-emitting laser diodes and III-Nitride-based devices.

Key Skills

Education

Master’s Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, Materials Science, or equivalent. 6+ years of photonic or optoelectronic industry experience in new product development and product launch. Hands-on expertise in semiconductor laser diode packaging (e.g., 14-pin butterfly, TO-Cans, CoS). Experience managing photonic assembly vendors and coordinating with manufacturing teams. Skilled in statistical data analysis/visualization (e.g., JMP, R). Proficient in 3D CAD design tools (SolidWorks, AutoDesk Inventor). Strong understanding of thermal/mechanical constraints in laser packaging (heat transfer, stress, TEC). Knowledge of SPC, DfMA, FA, Root Cause Analysis, and Lean Manufacturing methods. Familiar with design constraints for on-chip photonic and electronic packaging (waveguides, wirebonds, vias, etc.). Excellent analytical, communication, and collaboration skills in multidisciplinary environments.