Description

You will serve as the technical lead for advanced packaging product lines.

Responsibilities

• Troubleshoot, optimize, and validate material application processes.
• Interface directly with customers to resolve product- or process-related issues, developing solutions hands-on.
• Design experiments, run tests, and analyze data on material behavior, reliability, and process compatibility.
• Ensure new and existing products deliver quantifiable customer value (yield, throughput, cost).
• Collaborate with internal teams (R&D, process engineering, quality, manufacturing) to transfer successful technologies.

Required Skills

• Bachelor's degree in Materials Science/Engineering, Chemical Engineering, Mechanical Engineering, or related field.
• 10+ years experience in a semiconductor advanced packaging environment (materials, adhesives, encapsulants, molding).
• Strong understanding of 2.5D/3D packaging, wafer-level encapsulation, molding, underfills, and interconnects.
• Proven track record taking a product from development through customer implementation.
• Strong experimental design, analytical, problem-solving, and characterization skills.
• Excellent verbal and written communication for customer interaction and presentations.
• Ability to work independently and cross-functionally.
• Proficiency with Project Management and Time Management.

Key Skills

Education

Bachelor's degree