Description

You will serve as the technical lead for advanced packaging product lines, troubleshooting and optimizing material application processes while validating product performance.

This role is on-site.

Responsibilities

• Troubleshoot, optimize, and validate material application processes to ensure reliability and compatibility.
• Interface directly with customers to resolve product issues, developing hands-on solutions.
• Design experiments, run tests, and analyze data on material behavior, yield, and throughput.
• Collaborate with R&D, process engineering, and manufacturing teams to transfer technologies.

Required Skills

• Bachelor's degree in Materials Science/Engineering, Chemical Engineering, Mechanical Engineering, or related field.
• 10+ years experience in a semiconductor advanced packaging environment (materials, adhesives, encapsulants, molding).
• Strong understanding of 2.5D/3D packaging, wafer-level encapsulation, molding, underfills, and interconnects.
• Proven track record taking a product from development through customer implementation.
• Strong experimental design, analytical, problem-solving, and characterization skills.
• Excellent verbal and written communication for customer interaction and presentations.
• Proficiency with Project Management and Time Management.

Key Skills

Education

Bachelor's degree