Description

You will design multilayer high-density interconnect printed circuits using ECAD software applications.

This role is on-site.

Responsibilities

• Design multilayer PCBs up to 12 layers with multiple lamination cycles.
• Execute designs involving blind and buried vias and sub 0.5mm pitch applications.
• Develop and generate technical drawings and documentation for PCB fabrication and assembly.
• Collaborate with PCB designers and Design Engineers to meet project schedules.

Required Skills

• 5+ years of experience in PCB design.
• Expertise in PCB layout techniques and electrical schematics.
• Proficiency with ECAD software applications.
• Experience designing multi-lam, blind and buried via, and sub 0.5mm pitch applications.
• Proven ability to create assembly drawings and electrical layouts.
• Knowledge of PCB fabrication and assembly drawing processes.

Preferred Skills

• Bachelor of Engineering (B.E) degree.

Key Skills

Education

Any Graduate