Description

You will own end-to-end RF module and SiP development from initial concept through mass production.

This role is on-site.

Responsibilities

• Lead module and SiP technology selection, part selection, and vendor evaluation including cost and performance analysis.
• Develop module architecture, schematics, and layouts while collaborating with vendors on DFM and manufacturing.
• Perform RF circuit, 3D EM, and thermal simulations to validate designs.
• Execute factory bring-up, lab bench debug, performance tuning, and validation of RF modules/SiPs.
• Design and validate advanced RF packaging prototypes and evaluate new packaging technologies.

Required Skills

• 3+ years of experience developing RF modules or SiPs, ideally in wireless consumer electronics.
• Bachelor's degree in Electrical Engineering or a related engineering discipline.
• Hands-on experience with RF schematic design, layouts, and DFM.
• Proficiency with RF lab equipment for device characterization, debug, and performance validation.
• Experience using Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, or Flotherm.
• Ability to develop RF test specifications and conduct testing using network analyzers, communication testers, spectrum analyzers, and oscilloscopes.
• Experience with advanced packaging technologies and RF module/SiP design.

Preferred Skills

• MS or PhD in EE with an emphasis on advanced packaging or RF design.
• 5+ years of relevant industry experience including WiFi, BT, GPS, and cellular RF implementation.

Key Skills

Education

Bachelor's degree