Description

Lead the design and development of new automotive power module packages.

This role is on-site.

Responsibilities

• Define substrate and package design rules, process flows, and material sets for new automotive power modules.
• Align module substrate (PCB) design requirements with supplier capabilities to support new product development and volume manufacturing.
• Develop new assembly technologies and execute process DOEs to define process windows.
• Drive reliability testing and qualification of automotive module packages in coordination with reliability groups.
• Collaborate with offshore assembly partners, substrate partners, and IC design teams to meet technical requirements.

Required Skills

• 12+ years of experience in semiconductor packaging technology.
• Proven experience with leaded multi-die packages.
• Deep understanding of organic laminate technologies, manufacturing, and supplier capabilities.
• Hands-on experience with Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation.
• Proficiency with package substrate design rules and AutoCAD.
• Knowledge of AEQ Automotive reliability requirements and APQP automotive development processes.
• Familiarity with JEDEC/IPC design standards.

Preferred Skills

• Experience in SMT, passive integrated package assembly, or Flip Chip.
• Ability to set up Design Rule Checks for PCB layout verification.

Key Skills

Education

ANY GRADUATE