Description

You will manage thermal design challenges for high-end switching products and define thermal strategies for future hardware generations.

Responsibilities

• Develop thermal cooling strategies for next-generation, high-performance switching products.
• Perform complete thermal analysis and design independently using Icepak.
• Support hardware and product management teams with spreadsheet calculations or detailed simulation results.
• Conduct engineering experimental tests at the component and system levels to verify designs and correlate with computational results.
• Collaborate with electrical design and hardware validation teams to meet system requirements.

Required Skills

• 5+ years of professional experience in thermal design and analysis of electronic appliances.
• Expertise in Icepak, FloTHERM, or SmartCFD.
• Experience with high power (>800W) SoC liquid cooling thermal models and system-level analysis.
• Background in cold plate liquid cooling design, including open/closed loop systems and CDU at rack or facility levels.
• Proficiency in numerical modeling using CFD and FEA, including convergence, discretization, and meshing.
• Deep knowledge of heat transfer modes: conduction, convection (passive and active), and radiation.
• Technical understanding of heat sinks, heat pipes, vapor chambers, fans, blowers, pumps, and thermal interface materials.
• Experience with flow and thermal measurement techniques and mechanical validation/qualification tests (ETE).
• Ability to perform thermal airflow testing and augment system thermal simulation models.
• Experience in vendor selection.

Preferred Skills

• Experience using ProEngineer (PTC Creo).
• Ph.D. in Mechanical Engineering.

Key Skills

Education

Bachelor's degree