Description

Architect next-generation thermal and mechanical solutions for data center servers at the component, board, and chassis levels.

Responsibilities

• Architect thermal and mechanical solutions including air cooling, single/two-phase liquid cooling, and immersion cooling.
• Define and own thermal specifications for silicon and cooling components to ensure seamless customer integration.
• Develop complex thermal models using CFD and FEA techniques to inform silicon and system-level design.
• Lead thermal, mechanical, and hardware engineering teams through mentorship and strategic direction.
• Coordinate with manufacturing partners, including CMs, OEMs, and ODMs, to develop prototypes and production parts.

Required Skills

• 15+ years of experience in cooling system design and electronics packaging for data centers.
• Expertise in liquid cooling technologies.
• Proficiency in Ansys Suite (Icepak, Mechanical) for CFD and FEA simulations.
• Experience with MCAD/PLM tools such as Creo/Windchill, SolidWorks, or NX/Teamcenter.
• Proven track record of technical leadership in engineering design and development teams.
• Experience working with contract manufacturers (CMs), OEMs, and ODMs.
• Ph.D. in Mechanical Engineering or equivalent practical experience with an emphasis on conjugate heat transfer.
• Demonstrated industry leadership through technical publications or patents.

Preferred Skills

• Familiarity with CPU socket design, assemblies, and semiconductor packaging.
• Knowledge of OCP mechanical design guidelines, including Colo boxes and rack designs.
• Experience with fabrication processes such as sheet metal, injection molding, and soft/hard tooling.

Key Skills

Education

Not specified